Shockproof Silicone Potting Compound For Industrial Sensor And Transducer Protection
Product Overview for silicone potting compound:
Boost your production efficiency. HN-8806 A/B reaches initial cure within 2 to 3 hours at 25°C, enabling fast turnaround for subsequent processes. Curing can be further sped up with heating — just 0.2 hours at 80°C. It is an ideal choice to streamline your production.
Technical Parameters for silicone potting compound:
| Pot Life (25°C) |
0.3-0.4 hours |
| Initial Cure (25°C) |
2-3 hours |
| Full Cure (25°C) |
4-12 hours or (80°C): 0.2 hours |
| Hardness (Shore A) |
45±5 |
| Viscosity |
2000-3000 mPa·S (A&B) |
| Mixing Ratio |
1:1 (by weight or volume) |
Product Applications for silicone potting compound:
1. Power Supplies, Drivers, PCBs
2. LEDs, EV Charging Stations, PV Inverters
3. New Energy Batteries, Sensors, Automotive Electronics
Usage Instructions for silicone potting compound:
1. Preparation: Get all parts ready before potting.
2. Mixing: Weigh and blend the two components at 1:1 ratio swiftly, and finish mixing within pot life.
3. Potting: Start encapsulation immediately.
4. Curing: At 25°C, the material is ready for handling in 2–3 hours. For full cure, bake at 80°C for 12 minutes.
FAQ for silicone potting compound:
Q: Can the part be moved after initial cure?
A: Yes, after initial cure, the part has sufficient strength for careful handling and light subsequent operations.
Q: How can I cure it faster?
A: Heating at 80°C for 0.2 hours (approx. 12 mins) achieves full cure.
Q: Does the compound harden immediately after the pot life?
A: No, it begins to thicken and enter the curing stage gradually, but completion within the pot life is recommended.
Q: Does fast curing mean a shorter shelf life?
A: No, cure speed and shelf life are separate. The unmixed components have a 6-month shelf life.
Q: Can heat curing damage my components?
A: 80°C is safe for most components. Evaluate or choose room temperature cure if extremely heat-sensitive parts are present.
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